Ansys TPA

Turbo Package Analyzer (TPA) provides package extraction and automation capability to address the electrical requirements of high-performance SiP, chip-scale, flip-chip, ball-grid array, and wire-bond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with Nexxim or alternative SPICE-compatible tools to perform subsequent transient analyses, such as crosstalk, overshoot, and TDR.

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